Glass / Rigid / In-line
In Line describes both a manufacturing methodology as well as a physical substrate movement. Separate load and unload stations moving product in and out of high vacuum while the process chamber remains under vacuum. This provides for higher utilization of consumables such as cathodes and thermal evaporation sources as well as reduces shield changes and preventative maintenance. Deposition can either be continuous where the substrate travels past the deposition source or static where the substrate is fixed in front of a deposition source before progressing through the system.
Substrate orientation can be vertical or horizontal with deposition from either above or below the substrate. Choice of substrate orientation is influenced by deposition method, substrate size, temperature, and throughput requirements.
Chamber arrangement
Configurable, modular platform for either vertical or horizontal systems, consist of Load Locks, Buffer / Heat Chambers, Transfer Chambers and Process Chambers. The number of each chamber type is based on specific coating requirments and line speed.
Process Chambers
Configured typically with Rotatable or Planar cathodes (DC,AC,RF) and plasma pre and post treatments. Single or multiple deposition zones can be configured to create multi-layer coatings by alternating target materials, deposition methodology or vacuum process levels.
Product Lines
Each of the below pre-cut lines are highly configurable based on specific process requirements that balances the cost of capital with production uptime and yield. Each product and application has unique cost and yield drivers and Mustang works with customers to identify each of these critical factors to ensure the highest level of customer value.
Glossary of Terms
Horizontal systems
substrate is loaded and unloaded horizontally. Coating source is above or below the substrate and substrate moves fully supported by either rollers or a carrier. Horizontal systems offer the ease of handling either large format substrates like architectural glass up to 3.3 meters wide or multiple substrates such as 3 or 4 standard 660mm substrates across a horizontal deposition area.
Vertical systems
Substrate enters coating system in a vertical (typically 7 degrees off center) supported primarily but the edge of the substrate and moved through the coating system in a vertical orientation Vertical systems offer the least impact from particle contamination from deposition sources and shield flaking as particles fall directly to the bottom of the chamber. For smaller, multiple substrates there is a trade-off in material handling by reducing coating areas or using carriers.
Carriers
Typically a metal frame that matches the substrate size and holds the substrate by a precise edge leaving the middle of the substrate not supported and able to be coated from either side. Carriers are most often required when deposition is from below the substrate on horizontal systems or for multiple substrates short side leading on vertical or horizontal systems.
Load lock / Buffer chambers
Load lock / Buffer chambers transition substrates from atmosphere to vacuum. High vacuum valves are positioned on either end of vacuum chamber and chambers vent to atmosphere and pump down to high vacuum before progressing a substrate into a coating system maintaining a high vacuum inside the coating areas of a system.
Transition chambers
Transition chambers accelerate and decelerate substrates from continuous flow to static mode when entering or leaving a continuous deposition process chamber(s) to either buffer or load lock chambers.
