The ultimate measure of production solutions is capacity, yield and uptime. Mustang engineering and applications teams are highly focused on each of these factors for both standard and custom products to ensure the highest value for our customers. Leveraging our proven production system experience, Mustang creates customized deposition solutions for a wide range of vacuum deposition processes. Let your process define the solution… Mustang can customize any piece of equipment to meet your specific needs. Increase your thoughput with the right Deposition Equipment… Mustang Deposition Systems are designed to make regular maintenance easy, reducing time needed for these activities, thus increasing throughput and yield.
- Fast change replaceable vacuum deposition chamber shielding
- Uniform heat, vacuum, deposition and substrate motion
- Ergonomic controls and maintenance access
- Integrated material handling for cathodes to reduce target change time
- High efficiency substrate loading and unloading
Optimizing deposition chamber design for both material and substrate ensures the highest level of material utilization and effective deposition rates.
SUBSTRATE TYPES
Mustang designs coating systems for almost any type of substrate and situation, from complex 3-dimensional parts to flexible rolled material, flat glass, wafers, etc., stand-alone or in-line …
3D – Complex geometries and high aspect ratio pockets require the high vacuum and high power cathodes that has made Mustang a global leader for the sputter and evaporation of metals on complex three dimensional parts such as headlamps, cosmetic packaging and lighting reflectors.
Flexible – 20CM to 200CM wide continuous substrate deposition for pilot to volume production solutions. Complete process recipe control including variable tension, taper drive control, vacuum isolated wind and unwind capabilities, as well as, solutions for single side touch with interleaf. Production proven standard products which are modular allow Mustang to customize web handling and deposition zones for any application.
Flat – flat substrates can range from 3.3 Meter wide architectural glass substrates to carrier based horizontal wafer tools. Static or continuous deposition for either single or multiple flat substrates is offered for either vertical or horizontal orientations by evaporation, sputter or PECVD. Both inline and batch substrate handling solutions, enable Mustang to customize production solutions for a wide range of flat substrates.
InLine – Continuous load locked deposition processes, typically reference separate load and unload stations, allowing substrates to progress through either a single or a range of processes. This design methodology can be used for any size or shape product. The understanding of process synchronization and continuous flow, high vacuum system design, is what allows Mustang to bring our volume production methodology to InLine solutions.
